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Content by TopicResource TypesPopularity | Intel Architecture and Silicon Cadence
In it's relentless pursuit of Moore’s Law, Intel has embarked on a coordinated and accelerated pace of architecture innovation based on its industry-leading silicon expertise, and its architecture design capabilities that will provide the growth driver for the next decade and beyond. In this white paper Intel explains it’s strategy of introducing a new microarchitecture linked to a new generation of silicon technology every two years.
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One Comment
I don’t know that I am contacting the right department or not. This is comment is covering tow issues:
1- More quiet system;
I have done some experiences but because of shortage of equipments it just stayed with me & Intel technical engineers who were attending in Intel seminars (in Vancouver) during more than the last 2.5 or 3 years. Today there are new motherboards in the market with built in “Heat sinks” to keep controller chips cooler (my idea). My another idea was to increase CPU’s contact area with it heat sink, the size of actual CPU’s may be reduced (65nm to 45nm) but there is a certain area dedicated to CPU’s heat sink. Now the CPU socket’s lock needs to be change, the socket structure will stay the same but the “metal” area where the heat comes out become wider with 2 stands on each side; this way we can have an air flow from under while the upper surface is connected to the heat sink. To lock the CPU the size of the socket’s lock needs to be extended as much the CPU size. By increasing the size heat dispensing area (double side), even lower voltage CPUs can easily run without fan.
2- Increasing the speed:
There so many software and tricks in the market to over clock the processor speed, I think the people who spend noticeable amount of money and take the risk of losing their processor do not mind to spend that money to buy faster CPU rather than over-clocking their own processor, especially now that faster front bus speed make it lot more easier to achieve than before.