During his keynote, titled “IA: The Intelligent Architecture Investment,” Pat Gelsinger, Intel senior vice president and general manager of the Digital Enterprise Group, discussed Intel’s latest client, server and embedded product lines, and gave developers an update on the latest programming tools available for the Larrabee architecture.
Intel’s complete Intel architecture future product roadmap was also revealed. Gelsinger said the “Nehalem” microarchitecture has received worldwide acclaim with the Core® i7 processor launch in 2008 and the recent Nehalem-based Intel® Xeon® 5500 series introduction. The Xeon 5500 series combines the world’s leading processor microarchitecture with a new memory and I/O subsystem, Intel® QuickPath Interconnect and Intel® Intelligent Power Technology to control power consumption.
Gelsinger said Intel and the industry now look to adopting more mainstream PC and laptop versions of the Nehalem microarchitecture, including 32nm manufactured versions with on-processor graphics, as well the multi-socket Nehalem EX server processor, all in production in the second half of 2009. The future Nehalem-EX processor will provide eight cores for the multiprocessor “intelligent server” market.
For embedded computers, Gelsinger discussed a range of recently announced Intel® Atom™ processor solutions with industrial temp for applications such as in-vehicle infotainment and industrial automation. He also disclosed, for the first time ever, the Nehalem-EP based processor (codenamed “Jasper Forest”) that is specifically designed to deliver increased compute density and integration required for embedded and storage applications.
Gelsinger also addressed Larrabee, which is Intel’s first many-core architecture designed for high throughput applications and features a programmable graphics pipeline that enables developer freedom. The Intel executive discussed availability of a C++ Larrabee Prototype Library and a future parallel programming solution based on “Ct” technology. The first Larrabee discrete graphics products are due in the late 2009/2010 timeframe.